The automatic inspection equipment to detect and classify wafer edge defects as well as to measure the size of required parts in the Si wafer or device manufacturing process
Edge Grinding / Single Side Grinding / Double Side Polishing / Cleaning / Drying / Prime Wafer Final Inspection / Epitaxy, Silicon on Insulator / Deposition / Lithography / CMP / Edge Trimming / Pasting / Thinning
Video 
The inspection equipment with high sensitive detection of deficiency / contamination of wafer back side and with three-dimensional sharp measurement of extracted defects in device manufacturing process
Deposition / Lithography / Etching / CMP
Video 
The inspection equipment to detect various kinds of deficiency of Wafer edge / both sides which occur is Si wafer manufacturing (Polishing / Epi) process
Edge Griding / Single Side Grinding / Double Side Polishing / Cleaning / Drying / Prime Wafer Final Inspection / Epitaxy, Silicon on Insulator
Video 
The AXM series is state-of-the-art equipment that demonstrates its powerful capabilities during final appearance inspection of wafer fabrication. Beginning with the new method of Notch inspection, the edge/front/back inspection capability has been further improved, defect classification is automatically performed by the newly developed original algorithm, and various new functions are equipped.
Edge in the Silicon Wafer Manufacturing Process / Front / Back / Notch check
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